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T1250-800RTR View Datasheet(PDF) - STMicroelectronics

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Description
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T1250-800RTR Datasheet PDF : 12 Pages
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Packaging information
3
Packaging information
BTA12, BTB12, T12xx
Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 8. D2PAK dimensions
Dimensions
Ref.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
E
L2
A
C2
A 4.30
A1 2.49
A2 0.03
4.60 0.169
2.69 0.098
0.23 0.001
0.181
0.106
0.009
B 0.70
0.93 0.027
0.037
L
D
B2 1.25 1.40
0.048 0.055
L3
C 0.45
0.60 0.017
0.024
A1
C2 1.21
1.36 0.047
0.054
B2
B
C
R
D 8.95
9.35 0.352
0.368
G
E 10.00
10.28 0.393
0.405
A2
2mm min.
FLAT ZONE
G 4.88
L 15.00
5.28 0.192
15.85 0.590
0.208
0.624
V2
L2 1.27
1.40 0.050
0.055
L3 1.40
1.75 0.055
0.069
R
0.40
0.016
V2 0°
8° 0°
Figure 15. Footprint (dimensions in mm)
16.90
10.30
8.90
5.08
1.30
3.70
8/12
 

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