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UPB1005K View Datasheet(PDF) - NEC => Renesas Technology

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UPB1005K Datasheet PDF : 16 Pages
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µPB1005K
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent abnormal oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) Connect a bypass capacitor (example: 1 000 pF) to the VCC pin.
(5) Frequency signal input/output pins must be each coupled with external capacitor for DC cut.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Infrared Reflow
Partial Heating
Soldering Conditions
Package peak temperature: 235 °C or below
Time: 30 seconds or less (at 210 °C)
Count: 2, Exposure limitNote: None
Pin temperature: 300 °C
Time: 3 seconds or less (per side of device)
Exposure limitNote: None
Recommended Condition Symbol
IR35-00-2
Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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Preliminary Data Sheet P14016EJ1V0DS00
 

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