MC74LVX08D View Datasheet(PDF) - ON Semiconductor
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Description
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MC74LVX08D Datasheet PDF : 8 Pages
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MC74LVX08
OUTLINE DIMENSIONS
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 965–01
ISSUE O
14
1
Z
D
e
b
0.13 (0.005) M
8
E HE
7
LE
Q1
M_
L
DETAIL P
VIEW P
A
c
A1
0.10 (0.004)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A
ĆĆĆ 2.05 ĆĆĆ 0.081
A1 0.05 0.20 0.002 0.008
b 0.35 0.50 0.014 0.020
c 0.18 0.27 0.007 0.011
D 9.90 10.50 0.390 0.413
E 5.10 5.45 0.201 0.215
e
1.27 BSC
0.050 BSC
HE 7.40 8.20 0.291 0.323
L 0.50 0.85 0.020 0.033
LE 1.10 1.50 0.043 0.059
M
0 _ 10 _ 0 _ 10 _
Q1 0.70 0.90 0.028 0.035
Z
ĆĆĆ 1.42 ĆĆĆ 0.056
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