MC10104L View Datasheet(PDF) - ON Semiconductor
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MC10104L Datasheet PDF : 6 Pages
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−L−
20
MC10H104
PACKAGE DIMENSIONS
−N−
Y BRK
−M−
W
1
V
20 LEAD PLLC
CASE 775−02
ISSUE E
B 0.007 (0.180) M T L−M S N S
U 0.007 (0.180) M T L−M S N S
D
Z
D
X
G1 0.010 (0.250) S T L−M S N S
VIEW D−D
A 0.007 (0.180) M T L−M S N S
Z
R 0.007 (0.180) M T L−M S N S
H 0.007 (0.180) M T L−M S N S
C
E
K1
G
G1
0.010 (0.250) S T L−M S
0.004 (0.100)
K
J −T− SEATING
PLANE
VIEW S
F 0.007 (0.180) M T L−M S
VIEW S
NS
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM −T−, SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
INCHES
DIM MIN MAX
A 0.385 0.395
B 0.385 0.395
C 0.165 0.180
E 0.090 0.110
F 0.013 0.019
G
0.050 BSC
H 0.026 0.032
J 0.020 −−−
K 0.025 −−−
R 0.350 0.356
U 0.350 0.356
V 0.042 0.048
W 0.042 0.048
X 0.042 0.056
Y −−− 0.020
Z
2 _ 10 _
G1 0.310 0.330
K1 0.040 −−−
MILLIMETERS
MIN MAX
9.78 10.03
9.78 10.03
4.20 4.57
2.29 2.79
0.33 0.48
1.27 BSC
0.66 0.81
0.51 −−−
0.64 −−−
8.89 9.04
8.89 9.04
1.07 1.21
1.07 1.21
1.07 1.42
−−− 0.50
2 _ 10 _
7.88 8.38
1.02 −−−
NS
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