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MC74AC00DG View Datasheet(PDF) - ON Semiconductor

Part Name
Description
View to exact match
MC74AC00DG
ON-Semiconductor
ON Semiconductor ON-Semiconductor
MC74AC00DG Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
MC74AC00, MC74ACT00
PACKAGE DIMENSIONS
SOIC14
CASE 751A03
ISSUE H
14
1
T
SEATING
PLANE
A
8
BP 7 PL
0.25 (0.010) M B M
7
G
C
R X 45 _
F
D 14 PL
K
M
J
0.25 (0.010) M T B S A S
SOLDERING FOOTPRINT*
14X
0.58
7X
7.04
1
14X
1.52
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A 8.55 8.75 0.337 0.344
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC
0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0_ 7_ 0_ 7_
P 5.80 6.20 0.228 0.244
R 0.25 0.50 0.010 0.019
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
 

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