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TL431ACD View Datasheet(PDF) - ON Semiconductor

Part Name
Description
View to exact match
TL431ACD
ON-Semiconductor
ON Semiconductor ON-Semiconductor
TL431ACD Datasheet PDF : 19 Pages
First Prev 11 12 13 14 15 16 17 18 19
TL431, A, B Series, NCV431A, B
PACKAGE DIMENSIONS
HE
PIN 1 ID e
SEATING
−T− PLANE
0.038 (0.0015)
Micro8
DM SUFFIX
PLASTIC PACKAGE
CASE 846A−02
ISSUE G
D
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846A−01 OBSOLETE, NEW STANDARD 846A−02.
b 8 PL
0.08 (0.003) M T B S A S
A
MILLIMETERS
DIM MIN NOM MAX
A
−−
−−
1.10
A1 0.05
0.08
0.15
b
0.25
0.33
0.40
c
0.13
0.18
0.23
D 2.90
3.00
3.10
E 2.90
3.00
3.10
e
0.65 BSC
L
0.40
0.55
0.70
H E 4.75
4.90
5.05
MIN
−−
0.002
0.010
0.005
0.114
0.114
0.016
0.187
INCHES
NOM
−−
0.003
0.013
0.007
0.118
0.118
0.026 BSC
0.021
0.193
MAX
0.043
0.006
0.016
0.009
0.122
0.122
0.028
0.199
A1
c
L
SOLDERING FOOTPRINT*
1.04
8X 0.041
0.38
0.015 8X
3.20
0.126
4.24 5.28
0.167 0.208
0.65
6X 0.0256
ǒ Ǔ SCALE 8:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
18
 

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